Arlitech server thermal module, the power of innovation and progress.
A server typically refers to a computer system or device that is used to provide various services, resources, or functionalities to other devices or clients. It operates in a network environment, receiving and processing requests from clients and responding with corresponding information or services. Servers can be physical devices, such as host machines located in data centers, or they can be virtual servers in virtualized or cloud environments.
Servers can be classified into several common types:
- Tower Server: It has a tower-like form factor, similar to a vertical box, and is typically suitable for small to medium-sized businesses or office environments.
- Rack Server: Designed to be installed in rack structures, rack servers often offer higher density and scalability, making them suitable for large-scale data centers and enterprises.
- Blade Server: Blade servers modularize server hardware into smaller form factors, providing higher density and energy efficiency. They are suitable for environments requiring a large number of server deployments.
- Modular Server: Modular servers combine computing, storage, and networking functions into a single module. They can be expanded or scaled down as needed, offering flexibility and scalability.Additionally, there are servers designed for specific purposes such as storage servers, virtualization servers, database servers, application servers, and more. These servers are optimized and configured based on their specific functions and use cases.
Arlitech's supported server cooling modules include those for Intel CPU-related generations and server platforms/chipsets as follows:
- Brickland: This refers to Intel's second to third-generation Xeon E7 series server platforms. These platforms are based on Intel's Ivy Bridge and Haswell microarchitectures and are optimized for high-performance, high-capacity server workloads.
- Grantley: This represents Intel's fourth to fifth-generation Xeon E5 and E7 series server platforms. These platforms are based on Intel's Haswell and Broadwell microarchitectures and provide higher performance, improved energy efficiency, and scalability.
- Purley: This represents Intel's sixth to seventh-generation Xeon Scalable series server platforms. These platforms are based on Intel's Skylake and Cascade Lake microarchitectures and introduce higher core counts, increased memory bandwidth, and more expansion options.
- Whitley: This represents Intel's eighth to ninth-generation Xeon Scalable series server platforms. These platforms are based on Intel's Cascade Lake and Cooper Lake microarchitectures, offering higher performance, improved energy efficiency, and enhanced security features. Additionally, the latest platform, Eagle Stream, is also supported by Arlitech.
Intel Platform LGA 4677_Eagle Stream Parameters
In addition to Intel, AMD is also a major supported brand for Arlitech's server cooling modules. AMD's platforms share the following characteristics, and each platform upgrade typically brings higher performance, more cores, improved cache and memory architecture, and advanced process technology. These improvements aim to deliver better server performance, energy efficiency, and scalability to meet various workload demands.
- Naples: Naples is the codename for the first-generation AMD EPYC series server processors. Based on the Zen microarchitecture and utilizing the SP3 socket, it supports high core counts and multi-threaded processing, providing powerful server performance and scalability.
- Rome: Rome is the codename for the second-generation AMD EPYC series server processors. It is also based on the Zen microarchitecture but utilizes an enhanced 7nm process technology. The Rome platform offers higher core counts, larger cache capacity, improved performance while maintaining compatibility with the SP3 socket.
- Milan SP3: Milan is the codename for the third-generation AMD EPYC series server processors. Similarly based on the Zen 3 microarchitecture, it incorporates the more advanced 7nm+ process technology. The Milan platform provides higher performance, increased core counts, and improved cache architecture while maintaining compatibility with the SP3 socket.
- Genoa SP5: Genoa is the codename for the upcoming fourth-generation AMD EPYC series server processors, expected to be released in 2022. Genoa will be based on the Zen 4 microarchitecture and is anticipated to introduce the more advanced 5nm process technology. It aims to offer higher performance, larger core counts, improved memory and I/O capacity, and other performance and energy efficiency enhancements.
ADM Platform Socket SP5 Parameters
In recent years, driven by emerging applications such as 5G, AI, and cloud computing, the global internet user population is projected to grow from 3.9 billion in 2018 to 5.3 billion in 2023, with a compound annual growth rate of 6%. This growth also fuels a significant increase in the number of connected devices. The four major cloud service providers in North America, including Google, AWS, Meta, and Microsoft, continue to invest heavily in server-related infrastructure. Since 2016, the number of large-scale data centers has been growing at a compound annual growth rate of 13%. Although the server industry has been affected by high inflation and interest rates this year, leading to a slowdown in global economic growth, server vendors Dell and HPE have also adjusted their production volumes. Research firm TrendForce has revised down its global server shipment forecast for this year to 1.443 million units, with a year-on-year growth rate of 1.31%. However, compared to consumer applications such as smartphones and computers, the server industry continues to maintain growth in the technology sector.
With the continuous evolution of AI, there is a growing demand for computational power, and chip performance is becoming increasingly powerful. The two major server processor vendors, Intel and AMD, have respectively launched Intel Eagle Stream (code-named Sapphire Rapids, Emerald Rapids) and AMD EPYC Genoa (SP5) in the past year. Their maximum power consumption ranges from 350-375W and 300-400W, respectively, representing an increase of approximately 40-50% compared to the previous generation processors. As the maximum power consumption of chips continues to increase, the demand for heat dissipation also increases.
Arlitech's thermal solutions division has gradually expanded its product offerings and started focusing on areas such as base stations and servers. The shipped products include fans, chassis, heat spreader modules, heat pipe modules, and more. Arlitech serves customers from both domestic and international markets, and its market share has been steadily increasing over the years. With a diverse product line and the ability to provide one-stop and customized services to data center customers, Arlitech's thermal solutions division is expected to be a key driver of growth, especially with the increasing adoption of AMD and Intel's new server platforms.
If you have any questions or would like further information on Arlitech's server thermal solutions products, please feel free to contact us.